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Description

Job Type: Full-Time | Location: Remote | Department: Network | Reporting to:  Vice President, Cloud | Work Location Type: #remote #hybrid 

IREN is a vertically integrated AI Cloud provider, delivering large-scale data centers and GPU clusters for AI training and inference. IREN’s platform is underpinned by its expansive portfolio of grid-connected land and power in renewable-rich regions across North America, Europe and APAC. 

With 100% renewable energy, we build, own and operate our data centers and take pride in being at the forefront of sustainable solutions for the ever-evolving applications of high-performance compute. We believe that human progress is invaluable, but it should be done in the right way – responsibly, sustainably and having a positive impact on the communities we operate in. 

The Director, Reliability Hardware Systems owns end-to-end hardware reliability and failure analysis (FA) for IREN’s AI infrastructure, serving as the primary advocate for product stability and long-term performance across the full hardware portfolio, including GPUs, servers, racks, networking, and storage. Reporting to the [Reporting Manager], this leader directs multiple system-level reliability teams, drives root-cause investigations of complex field failures, and applies physics-of-failure and reliability statistics to predict product life and eliminate wear-out mechanisms before they reach the field. This leader acts as the reliability “glue” across engineering disciplines, partnering closely with Hardware Engineering, Mechanical, Thermal, PCB Layout, Manufacturing, Supply Chain, Quality, and Data Center Operations to build reliability into every stage of the hardware lifecycle, from initial specification through production and field operation.

Requirements

  • Bachelor’s or Master’s degree in Materials Science and Engineering, Electrical Engineering, Mechanical Engineering, or a related technical field.
  • 15+ years of overall experience in hardware reliability, failure analysis, or system qualification, including 8+ years of management experience leading teams of 10+.
  • Deep understanding of physics of failure and reliability physics related to semiconductors, PCBAs, and interconnects (e.g., electromigration, stress-induced voiding, thermal fatigue).
  • Hands-on experience with advanced failure analysis (FA) techniques such as cross-sectioning, SEM/EDX, CSAM, X-ray, and dye & pry to identify root causes at the material and structural level.
  • Proficiency in reliability statistics, including Weibull analysis, accelerated life testing, and MTBF modelling.
  • Comprehensive knowledge of industry standards such as JEDEC, IPC, and Telcordia for component- and system-level qualification.
  • Demonstrated ability to multitask across many concurrent programs and coordinate reliability testing for numerous hardware platforms.
  • Proven ability to define new processes that improve test coverage and overall product quality.
  • Strong executive presence and cross-functional leadership skills, with a track record coaching and developing engineering managers and presenting reliability performance, risk, and corrective action plans to senior leadership.

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